ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,664, issued on Oct. 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Polish apparatus and methods for use" was invented by Chia-Hsiang Yen (Chiayi County, Taiwan) and Peng-Chung Jangjian (Zhudong Township, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polish apparatus and methods for manufacturing and use of the chemical mechanical polishing apparatus are discussed herein. In an embodiment, a polishing apparatus is provided that includes: a polishing pad coated with polypeptides; and an enzyme spraying device positioned adjacent to the polishing pad."
The patent was filed on May 16, 2...