US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Wafer-level die-transfer tool and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,683, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Wafer-level die-transfer tool and method" was invented by Shin-Wei Shen (Tainan City, Taiwan), Chi-Hsiang Chen (Taipei City, Taiwan), Yi-Chao Mao (Taoyuan City, Taiwan), Tsung-Fu Tsai (Changhua County, Taiwan) and Szu-Wei Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die-transfer tool includes a source frame stage, a target frame stage, a roller, and a driving mechanism. The source frame stage is configured to secure a first tape. The target frame stage is configured to secure a second tape, wherein the second tape ha...