US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,749, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing thereof" was invented by Hung-Jen Hsu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is manufactured by a process including identifying a course extending between a minimum distance between a first perimeter of a first conductive pad and a second perimeter of a second conductive pad. The process can include forming a first conductive trace crossing the identified course. The first conductive trace can extend along a direction perpendicular to the course."...