US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,242, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Jui-Wen Chang (Hsinchu, Taiwan), Feng-Ming Chang (Hsinchu, Taiwan), Jui-Lin Chen (Taipei, Taiwan), Lien-Jung Hung (Taipei, Taiwan) and Ping-Wei Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first memory array with a first side; a second memory array with a second side that faces the first side; and a well pickup region between the first memory array along the first side and the second memory array along the second side...