US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,832, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of fabricating the same" was invented by Ching-Chen Li (Hsinchu City, Taiwan), Sung-Chi Chang (Hsinchu City, Taiwan), Chin-Chuan Chang (Hsinchu County, Taiwan), Wei-Jhan Tsai (Kaohsiung City, Taiwan), Hao-Wei Lin (Hsinchu City, Taiwan) and Ying-Ching Shih (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first semiconductor die, a second semiconductor die, an insulating encapsulant and a redistribution layer. The insulating encapsulant laterally surrounds the first semico...