US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Method of fabricating semiconductor device having dummy micro bumps between stacking dies" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,844, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of fabricating semiconductor device having dummy micro bumps between stacking dies" was invented by Tsung-Fu Tsai (Changhua County, Taiwan), Chen-Hsuan Tsai (Taitung City, Taiwan), Chung-Chieh Ting (Hsinchu, Taiwan), Shih-Ting Lin (Taipei City, Taiwan) and Szu-Wei Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device is provided. The method includes providing a die stacking unit that includes a plurality of dies stacked on each other, and a plurality of conductive joints con...