US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Manufacturing method of package structure and package structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,834, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Manufacturing method of package structure and package structure thereof" was invented by Po-Yuan Teng (Hsinchu city, Taiwan), Hao-Yi Tsai (Hsinchu City, Taiwan), Kuo-Lung Pan (Hsinchu city, Taiwan), Sen-Kuei Hsu (Kaohsiung City, Taiwan), Tin-Hao Kuo (Hsinchu City, Taiwan), Yi-Yang Lei (Taichung City, Taiwan), Ying-Cheng Tseng (Tainan City, Taiwan) and Chi-Hui Lai (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including at least one semiconductor die and a redistribution structure is provided. The semiconduc...