US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Layout design methodology for stacked devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,446, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hshinch, Taiwan).

"Layout design methodology for stacked devices" was invented by Fong-Yuan Chang (Hsinchu County, Taiwan), Po-Hsiang Huang (Tainan City, Taiwan), Chin-Chou Liu (Hsinchu, Taiwan), Chin-Her Chien (Chung-Li City, Taiwan) and Ka Fai Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A layout design methodology is provided for a device that includes two or more identical structures. Each device can have a first die, a second die stacked over the first die and a third die stacked over the second die. The second die can include a firs...