US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Integrated circuit packages and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,417, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods" was invented by Jen-Chun Liao (Taipei City, Taiwan), Yen-Hung Chen (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Sung-Yueh Wu (Chiayi County, Taiwan), Chih-Wei Lin (Zhubei City, Taiwan) and Kung-Chen Yeh (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package including integrated circuit dies and a method of forming are provided. The integrated circuit package may include a first integrated circuit die and a second integrated circuit die bonded to the first ...