US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Bonded semiconductor device and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,774, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Bonded semiconductor device and method for forming the same" was invented by Shih-Han Huang (Kaohsiung City, Taiwan), Wen-I Hsu (Tainan City, Taiwan), Shuang-Ji Tsai (Tainan City, Taiwan), Ming-Hsien Yang (Taichung City, Taiwan), Yen-Ting Chiang (Tainan City, Taiwan), Shyh-Fann Ting (Tainan City, Taiwan), Feng-Chi Hung (Hsin-Chu County, Taiwan), Jen-Cheng Liu (Hsin-Chu City, Taiwan) and Dun-Nian Yaung (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for wafer bonding includes receiving a layout of a bonding layer with...