US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 26 for "Photonic package and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,645, issued on May 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Photonic package and method for forming the same" was invented by Yu-Yi Huang (Taipei City, Taiwan), Yu-Hao Kuo (Hsinchu County, Taiwan), Chiao-Chun Chang (Hsinchu County, Taiwan), Jui-Hsuan Tsai (Taipei City, Taiwan), Yu-Hung Lin (Taichung City, Taiwan), Shih-Peng Tai (Xinpu Township, Hsinchu County, Taiwan), Jih-Churng Twu (Hsinchu County, Taiwan) and Chen-Hua Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor package is provided. The method includes forming a micro lens recessed from th...