US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Vacuum tip assembly for use in pick-and-place tool" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,629,848, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Vacuum tip assembly for use in pick-and-place tool" was invented by Ching Hsien Liu (Hsinchu, Taiwan), Sheng-Po Tseng (Hsinchu, Taiwan), Chen Liang Chang (Hsinchu, Taiwan), Chin-Szu Lee (Hsinchu, Taiwan) and Yi Chen Ho (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure provide die pick and place tools with an improved vacuum tip that can perform attachment and detachment of an integrated circuit die without deforming dies. In one embodiment, a vacuum tip for transporting an integrated circuit di...