US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Semiconductor devices and methods of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,235, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of fabricating the same" was invented by Shuen-Shin Liang (Hsinchu, Taiwan), Hong-Mao Lee (Hsinchu, Taiwan), Sung-Li Wang (Hsinchu, Taiwan), Yan-Ming Tsai (Hsinchu, Taiwan), Po-Chin Chang (Hsinchu, Taiwan), Wei-Yip Loh (Hsinchu, Taiwan), Harry Chien (Hsinchu, Taiwan) and Pei-Hua Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor fin protruding from a substrate. The semiconductor device includes a P-type device over the semiconductor fin and an N-type d...