US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Semiconductor devices and methods of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,207, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of fabricating the same" was invented by Yi-Hsiang Chao (Hsinchu, Taiwan), Peng-Hao Hsu (Hsinchu, Taiwan), Yu-Shiuan Wang (Hsinchu, Taiwan), Chi-Yuan Chen (Hsinchu, Taiwan), Yu-Hsiang Liao (Hsinchu, Taiwan), Chun-Hsien Huang (Hsinchu, Taiwan), Hung-Chang Hsu (Hsinchu, Taiwan), Wei-Jung Lin (Hsinchu, Taiwan), Chih-Wei Chang (Hsinchu, Taiwan) and Ming-Hsing Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a source/drain feature in the semiconductor layer. The semi...