US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Semiconductor arrangement and method for making" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,497, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Semiconductor arrangement and method for making" was invented by Pin-Wen Chen (Keelung, Taiwan), Mei-Hui Fu (Hsinchu, Taiwan), Hong-Mao Lee (Hsinchu, Taiwan), Wei-Jung Lin (Hsinchu, Taiwan) and Chih-Wei Chang (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor arrangement includes removing a portion of a first dielectric layer to form a first recess defined by sidewalls of the first dielectric layer, forming a first conductive layer in the first recess, removing a portion of the first conduc...