US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Patterning material including carbon-containing layer and method for semiconductor device fabrication" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,495, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Patterning material including carbon-containing layer and method for semiconductor device fabrication" was invented by Szu-Ping Tung (Taipei, Taiwan), Chun-Kai Chen (Kaohsiung, Taiwan), Tze-Liang Lee (Hsinchu, Taiwan) and Yi-Nien Su (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one exemplary aspect, the present disclosure is directed to a method for lithography patterning. The method includes providing a substrate and forming a target layer over the substrate. A patterning layer is formed by depositing a first layer having a...