US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Wafer chuck including self-sealing vacuum seal assemblies and methods for operating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,617, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wafer chuck including self-sealing vacuum seal assemblies and methods for operating the same" was invented by Wei-Yu Tsai (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan) and Ming-Tan Lee (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor processing apparatus includes a wafer chuck configured to hold a wafer on a top surface thereof. A plurality of lift-pin holes vertically extends through a chuck body of the wafer chuck. A plurality of lift pins are located in the plurality of lift-pin holes. A plurality of vacu...