US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Semiconductor structure and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,433, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Semiconductor structure and method of manufacture" was invented by Hung-Chou Lin (Douliu City, Taiwan), Yi-Cheng Chiu (New Taipei City, Taiwan), Chen-Chien Chang (Zhubei City, Taiwan), Kang-Tai Peng (Zhubei City, Taiwan) and Tian Sheng Lin (Taoyuan County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and method of manufacture is provided. In some embodiments, a semiconductor structure includes a first doped well doped with a first impurity having a first conductivity type, a second doped well adjacent the first do...