US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Package structure with lens structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,455, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure with lens structure and manufacturing method thereof" was invented by Yi-Jung Chen (Yilan County, Taiwan), Tsung-Fu Tsai (Changhua County, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan), Wei-An Tsao (Changhua County, Taiwan), Che-Yuan Yang (Hsinchu, Taiwan), Chien-Ting Chen (Taipei, Taiwan) and Chih-Chieh Hung (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes an optical die, an optical die, a supporting structure, and a lens structure. The optical die includes a photonic region. The optical die is...