US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Giga interposer integration through chip-on-wafer-on-substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,713, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Giga interposer integration through chip-on-wafer-on-substrate" was invented by Shang-Yun Hou (Jubei, Taiwan), Hsien-Pin Hu (Zhubei, Taiwan), Sao-Ling Chiu (Hsinchu, Taiwan), Wen-Hsin Wei (Hsinchu, Taiwan), Ping-Kang Huang (Chiayi, Taiwan), Chih-Ta Shen (Hsinchu, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan), Wen-Chih Chiou (Zhunan Township, Taiwan), Chi-Hsi Wu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first interposer; a second in...