US Patent Issued to Taiwan Semiconductor Manufacturing on March 31 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,707, issued on March 31, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Ching-Wen Chen (Kaohsiung City, Taiwan), Ming-Che Ho (Tainan City, Taiwan) and Hung-Jui Kuo (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure including a redistribution structure comprising dielectric layers and conductive layers alternately stacked is provided, wherein a dielectric layer among the dielectric layers of the redistribution structure comprises a first surface, a conductive layer among the conductive layers of the redistribution ...