US Patent Issued to Taiwan Semiconductor Manufacturing on March 31 for "Probe head structures for circuit probe test systems and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,992, issued on March 31, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Probe head structures for circuit probe test systems and methods of forming the same" was invented by Kuan Chun Chen (Hsinchu City, Taiwan), Shu An Shang (Kaohsiung City, Taiwan), Kai-Yi Tang (New Taipei City, Taiwan) and Guang-Sing Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A probe card for a circuit probe test system and methods of fabrication thereof. The probe card includes a substrate portion, a guide plate having a plurality of openings, and a plurality of probe pins extending through the openings, including at l...