ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,699, issued on March 31, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Chung-Yi Hsu (Hsinchu, Taiwan), Kai-Chiang Wu (Hsinchu City, Taiwan) and Yen-Ping Wang (Changhua County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor p...