US Patent Issued to Taiwan Semiconductor Manufacturing on March 31 for "Package lid with a vapor chamber base having an angled portion and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,693, issued on March 31, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package lid with a vapor chamber base having an angled portion and methods for forming the same" was invented by Po-Yao Lin (Hsinchu County, Taiwan), Yu-Chih Lai (Taipei, Taiwan), Yu-Sheng Lin (Zhubei, Taiwan) and Kathy Wei Yan (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, an interposer module on the package substrate, and a package lid on the interposer module and including a vapor chamber base, the vapor chamber base including a plate portion, and an angled portion extendi...