US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 31 for "Apparatus and method for manufacturing semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,462, issued on March 31, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Apparatus and method for manufacturing semiconductor structure" was invented by Chun-Hsi Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus and a method for forming a semiconductor structure are provided. The apparatus includes a polishing pad, a polishing head and a temperature control module. The polishing head mounts a substrate against the polishing pad. The temperature control module faces the polishing pad. The temperature control module includes a first temperature controller and a second temperature co...