US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 3 for "Photoresist composition and method of manufacturing semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,374, issued on March 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Photoresist composition and method of manufacturing semiconductor device" was invented by Wei-Han Lai (New Taipei, Taiwan), Li-Po Yang (Hsinchu, Taiwan), Shang-Wern Chang (Zhubei, Taiwan), Ching-Yu Chang (Yuansun Village, Taiwan), Tzu-Yang Lin (Tainan, Taiwan) and Chin-Hsiang Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Manufacturing semiconductor device includes forming photoresist layer. Photoresist layer is selectively exposed to actinic radiation and developed to form pattern. Photoresist composition includes: iodine...