US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 3 for "Particle removal method in semiconductor fabrication process" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,785, issued on March 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Particle removal method in semiconductor fabrication process" was invented by Chih-Ming Tsao (Miaoli County, Taiwan), Po-Cheng Chen (Kaohsiung, Taiwan) and Deng-An Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling hou...