US Patent Issued to Taiwan Semiconductor Manufacturing on March 3 for "Package structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,302, issued on March 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of forming the same" was invented by Chung-Ming Weng (Taichung City, Taiwan), Yu-Hao Chen (HsinChu City, Taiwan), Hao-Yi Tsai (Hsinchu City, Taiwan), An-Jhih Su (Taoyuan City, Taiwan), Tzuan-Horng Liu (Taoyuan City, Taiwan), Po-Yuan Teng (Hsinchu City, Taiwan), Tsung-Yuan Yu (Taipei City, Taiwan) and Che-Hsiang Hsu (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a package structure and a method of forming the same. The package structure includes a bottom package having a first sidewal...