US Patent Issued to Taiwan Semiconductor Manufacturing on March 3 for "High-speed delay line for die-to-die interconnect" (Taiwanese Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,858, issued on March 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"High-speed delay line for die-to-die interconnect" was invented by Shenggao Li (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods are provided for a delay line circuit that comprises a delay line core and a first current mirror circuit. The delay line core includes a plurality of inverters connected in series. Each of the plurality of inverters is coupled to a first common node. The first current mirror circuit includes a first current source configured to generate a first digital-to-analog (DAC) current, a first t...