US Patent Issued to Taiwan Semiconductor Manufacturing on March 24 for "Semiconductor testing device and method of operating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,953, issued on March 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor testing device and method of operating the same" was invented by Kong-Beng Thei (Hsinchu, Taiwan), Jung-Hui Kao (Hsinchu, Taiwan), Jing-Jung Huang (Hsinchu, Taiwan) and Fu-Hsiung Yang (Zhongli City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plurality of devices for testing, connected in series using one or more redistribution layers (RDLs), are used to perform a semiconductor device test on a plurality of dies. As a result, the semiconductor device test may support thousands of gross dies per wafer or greater (e.g., 1...