US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 24 for "Semiconductor package including an integrated circuit die and an inductor or a transformer" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,222, issued on March 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package including an integrated circuit die and an inductor or a transformer" was invented by Chung-Hao Tsai (Huatan Township, Taiwan), Chia-Chia Lin (Kaohsiung City, Taiwan), Kai-Chiang Wu (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung City, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment is a device including an integrated circuit die having an active side and a back side, the back side being opposite the active side, a molding compound encapsulating the integrated circuit d...