US Patent Issued to Taiwan Semiconductor Manufacturing on March 24 for "Semiconductor device and method of determining temperature of semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,801, issued on March 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of determining temperature of semiconductor device" was invented by Sin-I Du (Hsinchu County, Taiwan), Sui-An Yen (Taipei City, Taiwan), Chih-Pin Hung (Hsinchu City, Taiwan), Chang-Yu Huang (Hsinchu County, Taiwan) and Chung-Liang Cheng (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first substrate and a first device layer. The first device layer is disposed on the first substrate and includes a first region and a second region of the first device layer. T...