US Patent Issued to Taiwan Semiconductor Manufacturing on March 24 for "Liner-free conductive structures" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,268, issued on March 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Liner-free conductive structures" was invented by Shuen-Shin Liang (Hsinchu, Taiwan), Chun-I Tsai (Hsinchu, Taiwan), Chih-Wei Chang (Hsinchu, Taiwan), Chun-Hsien Huang (Hsinchu, Taiwan), Hung-Yi Huang (Hsinchu, Taiwan), Keng-Chu Lin (Chao-Chou Ping-Tung, Taiwan), Ken-Yu Chang (Hsinchu, Taiwan), Sung-Li Wang (Zhubei, Taiwan), Chia-Hung Chu (Taipei City, Taiwan) and Hsu-Kai Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a method for forming liner-free or barrier-free conductive structures. Th...