US Patent Issued to Taiwan Semiconductor Manufacturing on March 24 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,549, issued on March 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Teng-Yuan Lo (Hsinchu, Taiwan), Lipu Kris Chuang (Hsinchu, Taiwan) and Hsin-Yu Pan (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to th...