US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 24 for "Integrated circuit device and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,619, issued on March 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit device and methods" was invented by Bo-Feng Young (Hsinchu, Taiwan), Yu-Ming Lin (Hsinchu, Taiwan), Shih-Lien Linus Lu (Hsinchu, Taiwan), Han-Jong Chia (Hsinchu, Taiwan), Sai-Hooi Yeong (Hsinchu, Taiwan), Chia-En Huang (Hsinchu, Taiwan) and Yih Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes memory cells each including first through fourth memory elements. The first memory element is physically arranged, along a first axis, between a bit line and a first auxil...