US Patent Issued to Taiwan Semiconductor Manufacturing on March 24 for "InFO-POP structures with TIVs having cavities" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,523, issued on March 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"InFO-POP structures with TIVs having cavities" was invented by Jing-Cheng Lin (Hsinchu, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan) and Po-Hao Tsai (Zhongli City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial regio...