US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Stacked via structures and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,935, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Stacked via structures and methods for forming the same" was invented by Yen-Kun Lai (New Taipei City, Taiwan), Wei-Hsiang Tu (Hsinchu City, Taiwan), Ching-Ho Cheng (Hsinchu City, Taiwan), Cheng-Nan Lin (Hsinchu City, Taiwan), Chiang-Jui Chu (Yilan County, Taiwan), Chien Hao Hsu (Hsinchu County, Taiwan), Kuo-Chin Chang (Chiayi City, Taiwan) and Mirng-Ji Lii (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO...