US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,711, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method of manufacturing the same" was invented by Ke-Jing Yu (Kaohsiung, Taiwan), Yu-Chen Chang (Taoyuan, Taiwan), Anhao Cheng (Taichung, Taiwan), Yen-Liang Lin (Tainan, Taiwan) and Ru-Shang Hsiao (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate with fin features extending along a first direction; a plurality of gate stacks and a plurality of dummy pillars. The gate stacks are deposited over the substrate and extend along a second direction diffe...