US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,934, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Pokuan Ho (Taipei City, Taiwan), Chia-Tien Wu (Taichung City, Taiwan) and Cheng-Chi Chuang (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first conductive member, a second conductive member and a third conductive member. The first conductive member is extended through and is laterally surrounded by a first dielectric layer. The second conductive member is disposed over the first dielectric layer and the firs...