US Patent Issued to Taiwan Semiconductor Manufacturing on March 17 for "Semiconductor device and method of fabricating a semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,685, issued on March 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of fabricating a semiconductor device" was invented by Yu-Chi Lin (Hsinchu, Taiwan), Yu-Ting Weng (Taichung, Taiwan), Chiung Wen Hsu (Tainan, Taiwan) and Chao-Cheng Chen (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method of fabricating a semiconductor device are provided herein. The semiconductor device includes a substrate; a fin structure arranged on the substrate and including a ridge portion and a bottom portion between the ridge portion and the substrate, wher...