US Patent Issued to Taiwan Semiconductor Manufacturing on March 17 for "Selective metal cap in an interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,925, issued on March 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Selective metal cap in an interconnect structure" was invented by Wei-Jen Lo (Hsinchu, Taiwan), Syun-Ming Jang (Hsinchu, Taiwan), Ming-Hsing Tsai (Chu-Pei, Taiwan), Chun-Chieh Lin (Taichung, Taiwan), Hung-Wen Su (Jhubei, Taiwan), Ya-Lien Lee (Baoshan Township, Taiwan), Chih-Han Tseng (Tainan, Taiwan), Chih-Cheng Kuo (Taipei, Taiwan), Yi-An Lai (Hsinchu, Taiwan), Kevin Huang (Hsinchu, Taiwan) and Kuan-Hung Ho (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments provide a method and resulting structure that includes forming...