US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Methods of manufacturing semiconductor devices and semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,691, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods of manufacturing semiconductor devices and semiconductor devices" was invented by Ting-Yeh Chen (Hsinchu City, Taiwan), Wei-Yang Lee (Taipei City, Taiwan), Chia-Pin Lin (Xinpu Township, Taiwan) and Chih-Ching Wang (Jinhu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a semiconductor device, a fin structure, in which first and second semiconductor layers are alternately stacked over a substrate, is formed, a source/drain region of the fin structure is etched thereby forming a source/drain ...