US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Manufacturing method of package with magnetic shielding structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,865, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Manufacturing method of package with magnetic shielding structure" was invented by Harry-Hak-Lay Chuang (Hsinchu County, Taiwan), Yuan-Jen Lee (Hsinchu City, Taiwan) and Tien-Wei Chiang (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes an integrated circuit package and a magnetic shielding structure. The integrated circuit package includes a semiconductor chip. The magnetic shielding structure surrounds the integrated circuit package, in which the magnetic shielding structure including a top pla...