US Patent Issued to Taiwan Semiconductor Manufacturing on March 17 for "Bonding through multi-shot laser reflow" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,977, issued on March 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding through multi-shot laser reflow" was invented by Wei-Yu Chen (Taipei City, Taiwan), Chia-Shen Cheng (Zhubei City, Taiwan), Hao-Jan Pei (Hsinchu, Taiwan), Philip Yu-Shuan Chung (Taipei, Taiwan), Kuei-Wei Huang (Hsinchu, Taiwan), Yu-Peng Tsai (Hsinchu, Taiwan), Hsiu-Jen Lin (Zhubei City, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes performing a first laser shot on a first portion of a top surface of a first packa...