US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Via for semiconductor device connection" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,020, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Via for semiconductor device connection" was invented by Chen-Hua Yu (Hsinchu, Taiwan), An-Jhih Su (Taoyuan City, Taiwan), Chi-Hsi Wu (Hsinchu, Taiwan), Wen-Chih Chiou (Zhunan Township, Taiwan), Tsang-Jiuh Wu (Hsinchu, Taiwan), Der-Chyang Yeh (Hsinchu, Taiwan) and Ming Shih Yeh (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a via in a semiconductor device and a semiconductor device including the via are disclosed. In an embodiment, the method may include bonding a first terminal and a second terminal of a fi...