US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,074, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device" was invented by Yu-Chih Huang (Hsinchu, Taiwan), Chi-Hui Lai (Taichung City, Taiwan), Ban-Li Wu (Hsinchu, Taiwan), Ying-Cheng Tseng (Tainan City, Taiwan), Ting-Ting Kuo (Hsinchu, Taiwan), Chih-Hsuan Tai (Taipei City, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung City, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan) and Chiahung Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Tr...