US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Semiconductor structure having plurality of fin segments and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,853, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure having plurality of fin segments and method for forming the same" was invented by Kuan-Ting Pan (Taipei City, Taiwan), Kuo-Cheng Chiang (Zhubei City, Taiwan), Shi-Ning Ju (Hsinchu City, Taiwan), Jin Cai (Hsinchu City, Taiwan) and Chih-Hao Wang (Baoshan Township, Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure is provided. The method includes forming a first plurality of strip patterns and a second plurality of strip patterns that extend over an epitaxial sta...