US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,061, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of manufacturing the same" was invented by Tsung-Shu Lin (New Taipei City, Taiwan) and Hsuan-Ning Shih (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure is located on and electrically connected to the semiconductor die, the redistribution circuit structure includes a first contact pad having a first width and a second contact pad having a second width. The cond...