US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 9 for "Methods and systems for cooling plasma treatment components" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,651,729, issued on June 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods and systems for cooling plasma treatment components" was invented by Cheng Kuang Tso (Hsinchu, Taiwan), Chou-Feng Lee (Hsinchu, Taiwan), Chih-Hsien Hsu (Hsinchu, Taiwan), Chung-Hsiu Cheng (Banqiao, Taiwan) and Jr-Sheng Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of hole...