US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 9 for "Interconnect structure having heat dissipation capability and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,019, issued on June 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Interconnect structure having heat dissipation capability and method for manufacturing the same" was invented by Cheng-Chin Lee (Hsinchu, Taiwan), Hsin-Yen Huang (Hsinchu, Taiwan), Hsiao-Kang Chang (Hsinchu, Taiwan), Yen-Ju Wu (Hsinchu, Taiwan), Shao-Kuan Lee (Hsinchu, Taiwan), Li-Ling Su (Hsinchu, Taiwan) and Chia-Chen Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a base structure including a substrate and a device unit disposed on a front surface of the substrate, a front dielectric port...